High-Density DC-DC Topologies
Engineered for electric vehicle powertrains and heavy industrial R&D. We integrate silicon carbide (SiC) semiconductors to deliver extreme power density within highly constrained thermal envelopes.
Chassis-Integrated Topologies
Dynamic Load Regulation
Our systems survive severe transient response cycles without voltage sag. We optimize the physical PCB layout to minimize parasitic inductance, maintaining tight output regulation during rapid load steps.
Direct Thermal Paths
By machining liquid-cooling paths directly into the aluminum enclosure, we eliminate standard interface thermal barriers. This allows continuous operation at maximum power density without thermal throttling.
Measured Performance Curves
>98.4% Peak
400V / 800V
45 kW/L
Achieved using optimized SiC gate drivers and synchronous rectification across the entire operating voltage band.
Bi-directional conversion topologies supporting next-generation high-voltage EV battery architectures.
Ultra-compact footprint made possible by high switching frequencies and direct-to-chassis heat dissipation.
Submit Your Parameters
Provide your voltage, current, and thermal constraints. Our engineering team will review your topology requirements and respond with a preliminary schematic proposal.